重点关注 | 浏览量 : 68
下载量:
165
CSCD:
0
热时效对铜核SAC305微焊点组织及性能的影响
Effect of thermal aging on microstructure and properties of Cu-cored SAC305 micro-solder joints
- 2021年51卷第7期 页码:6-10
DOI: 10.7512/j.issn.1001-2303.2021.07.02
引用
阅读全文PDF
张焱, 零的应, 姚宗湘, 等. 热时效对铜核SAC305微焊点组织及性能的影响[J]. 电焊机, 2021,51(7):6-10.
ZHANG Yan, LING Diying, YAO Zongxiang, et al. Effect of thermal aging on microstructure and properties of Cu-cored SAC305 micro-solder joints[J]. 2021,51(7):6-10.
- 张焱, 零的应, 姚宗湘, 等. 热时效对铜核SAC305微焊点组织及性能的影响[J]. 电焊机, 2021,51(7):6-10. DOI: 10.7512/j.issn.1001-2303.2021.07.02.ZHANG Yan, LING Diying, YAO Zongxiang, et al. Effect of thermal aging on microstructure and properties of Cu-cored SAC305 micro-solder joints[J]. 2021,51(7):6-10. DOI: 10.7512/j.issn.1001-2303.2021.07.02.
扫 描 看 全 文