SAC0307/Cu电磁脉冲焊接接头的组织和性能研究

苏子龙; 徐永庚; 高雷; 王刚; 冉洋; 尹立孟

doi:10.7512/j.issn.1001-2303.2020.05.02

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SAC0307/Cu电磁脉冲焊接接头的组织和性能研究
Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding
2020年50卷第5期页码：10-15
DOI： 10.7512/j.issn.1001-2303.2020.05.02

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苏子龙, 徐永庚, 高雷, 等. SAC0307/Cu电磁脉冲焊接接头的组织和性能研究[J]. 电焊机, 2020,50(5):10-15.

SU Zilong, XU Yonggeng, GAO Lei, et al. Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding[J]. 2020,50(5):10-15.
苏子龙, 徐永庚, 高雷, 等. SAC0307/Cu电磁脉冲焊接接头的组织和性能研究[J]. 电焊机, 2020,50(5):10-15. DOI： 10.7512/j.issn.1001-2303.2020.05.02.

SU Zilong, XU Yonggeng, GAO Lei, et al. Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding[J]. 2020,50(5):10-15. DOI： 10.7512/j.issn.1001-2303.2020.05.02.

摘要

在保证空气间隙1.5 mm不变的情况下,采用电磁脉冲焊接技术分别在13 kV、14 kV和15 kV的充电电压下完成了99.0Sn-0.3Ag-0.7Cu(SAC0307)和T2 Cu薄板的连接,并对其焊接接头的显微组织、拉伸强度和显微硬度进行了研究。结果表明:SAC0307/Cu电磁脉冲焊接的临界充电电压介于13～14 kV之间;当充电电压为15 kV时,获得的焊接接头性能最佳,其拉伸强度为22.23 MPa,界面平均显微硬度为41.04 HV;此外,扫描电镜观察和X射线能谱分析发现,接头中基本没有金属间化合物形成。

Abstract

The electromagnetic pulse welding technology was ad opted to complete the connection of 99.0Sn-0.3Ag-0.7Cu（SAC0307） and T2 Cu thin plates with different charging voltage of 13 kV,14 kV,15 kV under the condition that the air gap was 1.5 mm. The microstructure,tensile strength and micro-hardness of the welded joints were then studied.The results show that the critical charging voltage of succe-ssful SAC0307/Cu electromagnetic pulse welding is between13 kV and14 kV;when the charging voltage is kept at 15 kV,the welded joint obtained has the best performance,its tensile strength is 22.23 MPa,and the average micro-hardness at the interface is 41.04 HV.In addition,scanning electron micros-copy and X-ray spectroscopy analysis reveal that no intermetallic compounds are found in the welded joints.