GAO Feng, XING Xiukuan, WANG Guoqiang, et al.Microstructure and Shear Strength of Diamond/Cu Alloy Joint Brazed with Ag-Cu-Sn-Cr Filler Metal[J].Electric Welding Machine, 2024, 54(2): 58-63.
The diamond film was brazed with copper alloy using Ag-Cu-Sn-Cr active brazing material. The study analyzed the effect of brazing temperature on the microstructure and mechanical properties of the joint. The results indicate that the interface between the brazing material and diamond is well bonded
and Cr in the brazing material reacts with diamond to form Cr
3
C
2
carbides at the interface. The center of the brazing seam is mainly composed of Cu based solid solution
Ag based solid solution
Cu
3
Sn intermetallic compound
and Cr. When the brazing temperature is in the range of 780~840 ℃
as the temperature increases
the interface reaction layer gradually thickens
and the shear strength of the brazed joint first increases and then decreases. At the optimal brazing temperature of 820 ℃ and holding time of 15 minutes
the maximum shear strength of the joint reached 147 MPa. By optimizing the brazing temperature
reliable connection between diamond film and copper alloy has been successfully achieved. This method can provide new ideas and technical approaches for the connection between hard and brittle materials and metals in actual industrial production.
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