To explore the residual stress distribution in soldering,the procedure and simulation of Au80Sn20/Sn63Pb37 solders in soldering 6061 aluminum alloy/4J34 Kovar alloy substrate are studied in this paper. The influence of the soldering procedure on the residual stress of the soldered joints is studied,and the soldering parameters are optimized by simulation and experimental study of residual stress. The results show that the residual stress near the Kovar side soldering seam is higher,and the soldered joint is more prone to fracture on the Kovar side.For Au80Sn20 solder,at the same soldering temperature,the residual stress at the aluminum alloy soldering seam increases slightly with the increase of the soldering time. For Sn63Pb37 solder,different soldering temperatures and soldering times have little effect on the numerical results. The measured results of X-ray residual stress are in good agreement with the calculated values,which proves the correctness of the simulation results,and provides an effective method for studying the reliability of lightweight alloy soldered joints in electronic products.