Research on the Influence of Ce on the Microstructure, Precipitation and Properties of High-performance Silicon White Copper Solder

JIA Fei; ZHAO Dan; CHENG Zhan; FAN Zhibin; NING Shaochen; LI Xiaoliang

doi:10.7512/j.issn.1001-2303.2024.10.04

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Research on the Influence of Ce on the Microstructure, Precipitation and Properties of High-performance Silicon White Copper Solder
Vol. 54, Issue 10, Pages: 32-41(2024)
Published： 25 October 2024 ，
DOI： 10.7512/j.issn.1001-2303.2024.10.04
稿件说明：

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贾飞，赵丹，程战，等.稀土Ce对高性能硅白铜焊料组织、析出和性能的影响规律研究［J］.电焊机，2024，54（10）：32-41.

JIA Fei, ZHAO Dan, CHENG Zhan, et al.Research on the Influence of Ce on the Microstructure, Precipitation and Properties of High-performance Silicon White Copper Solder[J].Electric Welding Machine, 2024, 54(10): 32-41.
贾飞，赵丹，程战，等.稀土Ce对高性能硅白铜焊料组织、析出和性能的影响规律研究［J］.电焊机，2024，54（10）：32-41. DOI： 10.7512/j.issn.1001-2303.2024.10.04.

JIA Fei, ZHAO Dan, CHENG Zhan, et al.Research on the Influence of Ce on the Microstructure, Precipitation and Properties of High-performance Silicon White Copper Solder[J].Electric Welding Machine, 2024, 54(10): 32-41. DOI： 10.7512/j.issn.1001-2303.2024.10.04.

摘要

为研究Ce族稀土元素对高性能硅白铜焊料的凝固组织、固溶组织、时效析出行为和性能的影响规律。采用扫描电镜（SEM）、透射电镜（TEM）和电子探针（EPMA）等设备，对添加不同Ce含量的Cu-Ni-Si焊料进行组织观察和性能测试。结果表明：Ce族稀土元素的添加显著细化了硅白铜焊料的凝固组织，焊料凝固组织晶粒尺寸由未添加前的200 μm减小到添加后的40 μm。添加Ce元素抑制了焊料的固溶再结晶进程，细化了再结晶晶粒尺寸，添加Ce前再结晶温度为900 ℃，添加Ce后提高至950 ℃，添加Ce前再结晶晶粒尺寸为180 μm，添加Ce后缩小为90 μm。Ce元素的添加可促进Ni、Si元素的析出和抑制过时效阶段析出相的长大，但不改变时效析出相的类型，时效析出相为圆盘状的δ-Ni

Si和棒状的β-Ni

Si。Cu-3.2Ni-0.75Si-0.06Ce硅白铜焊料焊料在450 ℃时效4 h后达到最佳性能，抗拉强度为747 MPa，剪切强度为454 MPa，相较于未添加Ce元素的Cu-3.2Ni-0.75Si焊料，抗拉强度提高了117 MPa，增幅为18.6%，剪切强度提高了91 MPa，增幅25%。

Abstract

The aim of this paper is to study the influence of Ce-group rare earth elements on the solidification structure

solid solution structure

aging precipitation behavior

and properties of high-performance silicon white copper solder. Scanning electron microscopy (SEM)

transmission electron microscopy (TEM)

and electron prob

e microanalysis (EPMA) were used to observe the microstructure and test the properties of Cu-Ni-Si solders with different Ce contents. The results show that the addition of Ce-group rare earth elements significantly refines the solidification structure of the silicon white copper solder

reducing the grain size from 200 μm to 40 μm after addition. The addition of Ce elements inhibits the solid solution recrystallization process of the solder and refines the recrystallized grain size

increasing the recrystallization temperature from 900 ℃ to 950 ℃ and reducing the recrystallized grain size from 180 μm to 90 μm. The addition of Ce elements can promote the precipitation of Ni and Si elements and inhibit the growth of precipitated phases during the over-aging stage

but it does not change the type of aging precipitated phases

which are disk-shaped δ-Ni

Si and rod-shaped β-Ni

Si. The Cu-3.2Ni-0.75Si-0.06Ce silicon white copper solder achieves the best performance after aging at 450 ℃ for 4 h

with a tensile strength of 747 MPa and a shear strength of 454 MPa. Compared to the Cu-3.2Ni-0.75Si solder without Ce elements

the tensile strength is increased by 117 MPa

an increase of 18.6%

and the shear strength is increased by 91 MPa

an increase of 25%.

关键词

硅白铜焊料Ce元素固溶处理时效析出抗拉强度

Keywords

silicon white copper solderCe elementsolution treatmentaging precipitationtensile strength

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