XUE Hangyan, GONG Hao, CHENG Donghai, et al.Microstructure and Properties of SiO2/ TC4 Brazed Joint with Cu Buffer Layer[J].Electric Welding Machine, 2024, 54(7): 62-67.
XUE Hangyan, GONG Hao, CHENG Donghai, et al.Microstructure and Properties of SiO2/ TC4 Brazed Joint with Cu Buffer Layer[J].Electric Welding Machine, 2024, 54(7): 62-67. DOI: 10.7512/j.issn.1001-2303.2024.07.09.
Microstructure and Properties of SiO2/ TC4 Brazed Joint with Cu Buffer Layer
The brazing joint of quartz glass/TC4 titanium alloy was brittle. to solve this problem
The vacuum brazing of quartz glass /AgCuTi/TC4 titanium alloy was carried out by adding Cu buffer layer in the weld. The effects of Cu buffer layer and different brazing processes on the microstructure and mechanical properties of SiO
2
/TC4 joint were analyzed. The results shows that: At the right brazing temperature
The addition of Cu buffer layer can form TiSi
2
+Ti
4
O
7
/Cu
2
Ti
4
O at the interface of SiO
2
/AgCuTi
and form a large amount of Cu solid solution in the weld
which can reduce the residual stress of the joints
and then improve the mechanical properties of the brazed joint. When the brazing temperature is 900 ℃ and the holding time is 10 min
the shear strength of the brazed joint with Cu buffer layer is the highest
LI Z S,ZHANG H F,LI L,et al. Effects of Novel Structure Bonding Materials on Properties of Aeronautical Acrylic[J]. Journal of Aeronautical Materials,2017,37(3):78-83.
Sun Y,Luo G Q,Zhang J,et al. Phase transition, microstructure and mechanical properties of TC4 titanium alloy prepared by plasma activated sintering[J]. Journal of Alloys and Compounds,2018,741(15):918-926.
Singh P,Pungotra H,Kalsin S. On the characteristics of titanium alloys for the aircraft applications[J]. Materials Today: Proceedings,2017,4(8):8971-8982.
XU Q B,LIU S Y. Grades of Titanium and Titanium Alloys Developed in Western Countries and Their Applications in the Aerospace Industry[J]. World Nonferrous Metals,2022(16):96-99.
Yang Z W,Zhang L X,Chen Y C,et al. Interlayer design to control interfacial microstructure and improve mechanical properties of active brazed Invar/SiO2-BN joint[J]. Materials Science and Engineering:A,2013,575:199-205.
Feng G,Li Z,Xu X,et al. Glass-copper anodic bonding through activated Sn-0.6Al solder[J]. Journal of Materials Processing Technology,2018,254:108-113.
Hu L,Xue Y,Wang H. Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder[J]. Journal of Alloys and Compounds,2019,789:558-566.
Elrefaey A,Janczak-Rusch J,Koebel M M. Direct glass-to-metal joining by simultaneous anodic bonding and soldering with activated liquid tin solder[J]. Journal of Materials Processing Technology,2014,214(11):2716-2722.
韩强. 对玻璃与金属封装外壳气密性的认识[J]. 电子与封装,2003,3(1):49-52.
HAN Q. The understanding of the air tightness of glass and metal package shell[J]. Electronics and Packaging,2003,3(1):49-52.
XIONG H P,WU S B,CHEN B,et al. Progress of methods for decreasing residual thermal stresses in ceramic /metal joints[J]. Transactions of The China Welding Institution,2013,34(09):107-112+118.
Miyamoto I,Cvecek K,Schmidt M. Advances of Laser Welding Technology of Glass-Science and Technology[J]. Journal of Laser Micro Nanoengineering,2020,15(2):63-76.
Yi R X,Chen C L,Peng Y X,et al. The bonding between glass and metal[J]. The International Journal of Advanced Manufacturing Technology,2020,111(3):963-983.
GONG H,CHENG D H,XUE H Y,et al. Microstructure and properties of SiO2/TC4 brazed joint[J]. Transactions of Materials and Heat Treatment,2023,44(7):182-188.
LIU D. Technology and Mechanism of Brazing SiO2 Ceramic to TC4 Alloy Using AgCu/Ni Composite Interlayer[D]. Heilongjiang: Harbin Institute of Technology,2010.