Numerical Simulation of Temperature-stress Field in Laser Soldering of Bumps

ZAI Jianxuan; LI Hui; GE Xiaohong; LI Fenqiang; WANG Qifan; HUANG Anguo

doi:10.7512/j.issn.1001-2303.2024.03.13

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Numerical Simulation of Temperature-stress Field in Laser Soldering of Bumps
Vol. 54, Issue 3, Pages: 80-88(2024)
Published： 25 March 2024 ，
DOI： 10.7512/j.issn.1001-2303.2024.03.13

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宰建轩，李辉，葛晓宏，等.高密度芯片激光钎焊温度场及应力场数值模拟研究［J］.电焊机，2024，54（3）：80-88.

ZAI Jianxuan, LI Hui, GE Xiaohong, et al.Numerical Simulation of Temperature-stress Field in Laser Soldering of Bumps[J].Electric Welding Machine, 2024, 54(3): 80-88.
宰建轩，李辉，葛晓宏，等.高密度芯片激光钎焊温度场及应力场数值模拟研究［J］.电焊机，2024，54（3）：80-88. DOI： 10.7512/j.issn.1001-2303.2024.03.13.

ZAI Jianxuan, LI Hui, GE Xiaohong, et al.Numerical Simulation of Temperature-stress Field in Laser Soldering of Bumps[J].Electric Welding Machine, 2024, 54(3): 80-88. DOI： 10.7512/j.issn.1001-2303.2024.03.13.

摘要

旨在探讨激光钎焊工艺参数对高密度芯片制造中凸点焊点质量的影响。通过有限元方法建立了三维瞬态热耦合数值模型，并利用高斯体热源模型和iSoldering软件模拟了SnAgCu钎料凸点激光钎焊的温度场和应力场，研究不同功率10 W、15 W、20 W和不同光斑半径0.09 mm、0.3 mm、0.5 mm下SnAgCu钎料钎焊焊点的变化规律。研究发现，激光功率和光斑半径是影响焊点质量的关键参数。在部分参数不变的情况下，随着激光功率的增大，钎料熔化更完全，润湿性更好，但也会产生更大的等效应力。增大光斑半径会导致焊点温度和等效应力降低。经过数值模拟和实际钎焊焊点的对比，结果表明：当激光功率为15 W、光斑半径为0.09 mm、焊接速度为0.1 mm/s时，SnAgCu凸点激光钎焊的焊点质量最佳，模拟凸点钎焊的焊点与实际钎焊结果吻合度达到85%，验证了模拟结果的准确性和可靠性。同时探讨了钎料与焊盘之间生成的金属间化合物厚度对焊点质量的影响，为提高焊点连接强度提供了理论依据。

Abstract

The study aims to explore the impact of laser brazing process parameters on the quality of bump solder joints in high-density chip manufacturing. A three-dimensional transient thermal coupling numerical model was established using finite element methods

and the Gaussian volume heat source model and iSoldering software were utilized to simulate the temperature and stress fields of SnAgCu brazed convex points. The research investigated the variation rules of SnAgCu brazing solder joints under different powers of 10 W

15 W

20 W

and different spot radii of 0.09 mm

0.3 mm

and 0.5 mm. The findings revealed that laser power and spot radius are the key parameters affecting solder joint quality. With some parameters remaining unchanged

an increase in laser power resulted in more complete brazing material melting

better wettability

but also greater equivalent stress. The increase in spot radius led to a decrease in solder joint temperature and equivalent stress. By comparing numerical simulations with actual brazed joints

the results showed that the best quality of SnAgCu convex point laser brazing solder joints was achieved when the laser power was 15 W

the spot radius was 0.09 mm

and the welding speed was 0.1 mm/s. The simulated convex point brazing solder joints matched the actual brazed results with an accuracy of 85%

verifying the accuracy and reliability of the simulation results. This study provides theoretical guidance for improving actual laser brazing processes and explores the impact of the thickness of intermetallic compounds formed between the brazing material and the solder pad on solder joint quality

offering a theoretical basis for enhancing solder joint connection strength.

关键词

激光钎焊凸点有限元分析温度场应力场

Keywords

laser solderingsalient pointfinite-element modelingtemperature fieldstress field

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