WANG Yafeng, WEI Lianfeng, YANG Fuquan, et al.Microstructure and Strength of SiC Ceramic Joints Diffusion Bonded by Spark Plasma Sintering with the SiC-Al2O3-Y2O3 Interlayer[J].Electric Welding Machine, 2023, 53(12): 1-6.
WANG Yafeng, WEI Lianfeng, YANG Fuquan, et al.Microstructure and Strength of SiC Ceramic Joints Diffusion Bonded by Spark Plasma Sintering with the SiC-Al2O3-Y2O3 Interlayer[J].Electric Welding Machine, 2023, 53(12): 1-6. DOI: 10.7512/j.issn.1001-2303.2023.12.01.
Microstructure and Strength of SiC Ceramic Joints Diffusion Bonded by Spark Plasma Sintering with the SiC-Al2O3-Y2O3 Interlayer
In this study, the pressureless-sintered SiC and SiC-based powder (SiC-Al,2,O,3,-Y,2,O,3,) were used as the substrate and interlayer, respectively, for joining of SiC ceramics by spark plasmas sintering. The microstructure and strength of SiC joints were investigated by means of metalloscope, scanning electron microscopy, energy spectroscopy, electron backscatter diffraction and shear test. The microstructural characterization indicated that the SiC joint exhibited a high-quality interface bonding with uniform thickness in the interlayer. The main phase compositions of the joint were β-SiC and Y-Al-Si-O-C. The fine β-SiC grains in the interlayer exhibited a random orientation. No significant β→α phase transition occurred at the joint due to the fast process of diffusion bonding by spark plasma sintering. Meanwhile, no significant stress concentration was observed at the interface because of the near-homogeneous SiC joint formed. The initial room temperature shear strength of the SiC joint was 219.9 MPa, which increased to 320.8 MPa after heat treatment in air at 800 ºC for 2 h. Further increasing the heat treatment temperature to 1300 ºC, the joint strength increased to 389.1 MPa. The joint fracture occurred mainly at the substrate with a river-like pattern, as a representative of brittle fracture. The increase of joint strength may be attributed to the interaction of Y-Al-Si-O-C and SiO,2, produced during the heat treatment process, healing the defects presented in the SiC substrate such as microcracks.
关键词
碳化硅放电等离子扩散连接微观组织剪切强度
Keywords
silicon carbidediffusion bonding by spark plasma sinteringmicrostructureshear strength
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