Application and development of laser soldering in microelectronic welding

PENG Birong; XIAO Hua; OUYANG Zhonghua; LI Shanyu

doi:10.7512/j.issn.1001-2303.2023.10.10

Welding Technology | Views : 0 下载量: 4 CSCD: 0

PDF
Export
Share
Collection
Album

Application and development of laser soldering in microelectronic welding
Vol. 53, Issue 10, Pages: 65-70(2023)
DOI： 10.7512/j.issn.1001-2303.2023.10.10

扫描看全文

彭必荣，肖华，欧阳忠华，等.激光软钎焊在微电子焊接领域的应用及发展［J］.电焊机，2023，53（10）：65-70.

PENG Birong, XIAO Hua, OUYANG Zhonghua, et al.Application and development of laser soldering in microelectronic welding[J].Electric Welding Machine, 2023, 53(10): 65-70.
彭必荣，肖华，欧阳忠华，等.激光软钎焊在微电子焊接领域的应用及发展［J］.电焊机，2023，53（10）：65-70. DOI： 10.7512/j.issn.1001-2303.2023.10.10.

PENG Birong, XIAO Hua, OUYANG Zhonghua, et al.Application and development of laser soldering in microelectronic welding[J].Electric Welding Machine, 2023, 53(10): 65-70. DOI： 10.7512/j.issn.1001-2303.2023.10.10.

摘要

随着现代电子技术的高速发展，微电子焊接领域对工艺可靠性及焊接质量要求相对更高。同时，产品结构精密程度增加、自动化生产要求及加工质量提升给传统微电子焊接工艺带来了更多考验。激光软钎焊作为一种新型微电子连接工艺在很多电子领域已成熟应用，相较于传统工艺方式，其非接触式、精准温控加热的焊接工艺特点在很多工艺场合有着明显优势。本文介绍了激光软钎焊工艺的基本原理，并与传统软钎焊形式进行对比，简单介绍了常见的三种激光软钎焊形式及相关工艺特点，列举了激光软钎焊在不同电子封装领域的应用情况及工艺优势。同时，还介绍了激光软钎焊中典型的焊接缺陷形式和当前激光软钎焊工艺难点。

Abstract

As the rapid development of modern electronic technology, the higher requirements of process reliability and soldering quality is needed in the field of microelectronic soldering. At the same time, the increase of product structure precision, the requirements of automatic production and the improvement of processing quality has brought more challenges to the traditional microelectronic welding process. As a new microelectronic connection process, laser soldering has been widely used in many electronic fields. Compared with the traditional soldering process, laser soldering with non-contact, precise temperature controlled heating process has obvious advantages in many process occasions. This paper introduces the basic principle of laser soldering and compares it with traditional soldering, briefly introduces three kings of common laser soldering and the process. The application and process advantages of laser soldering in different electronic packaging fields are illustrated. Meanwhile, typical defect forms and current difficulties in laser soldering process are described in this article.

关键词

激光软钎焊精密加工微电子焊接应用与发展

Keywords

laser solderingprecision machiningmicroelectronic weldingapplication and development

references

薛鹏，王俭辛，何鹏，等. 微电子焊接技术［M］. 北京：机械工业出版社， 2022.

韩彬，檀正东，周旋，等. 激光软钎焊技术在SMT领域内的现状与展望［J］. 电子工业专用设备， 2014， 43（01）： 1-7+12.

HAN B， TAN Z D， ZHOU X， et al. Status and prospect of laser soldering technology in SMT field［J］. Equipment for Electronic Products Manufacturing，2014，43（01）： 1-7+12.

董显，董博文，程亚芳，等.铝合金/钢异种金属激光熔钎焊技术研究进展［J］.电焊机，2023，53（4）：25-33.

DONG X， DONG B W， CHENG Y F， et al. Research Progress of Laser Brazing Technology for Dissimilar Metals of Aluminum Alloy and Steel［J］. Electric Welding Machine， 2023， 53（4）： 25-33.

龙伟民，井培尧，秦建.极端条件下焊接技术的研究进展［J］. 电焊机，2023，53（4）：1-13.

LONG W M， JING P Y， QIN J. Research Progress of Welding Technology Under Extreme Conditions［J］.Electric Welding Machine， 2023， 53（4）： 1-13.

黄博，基于锡膏微滴喷射的激光微焊接工艺实验研究［D］.福建：厦门理工学院， 2022.

HUANG B， Experimental study on laser micro welding technology based on solder paste micro droplet spraying［D］.Fujian： Xiamen University of Technology，2022.

龙绪明，黄昊，闫明，等.微电子智能制造技术的新发展［C］//2021中国高端SMT学术会议论文集，2021.

姜楠，张亮，熊明月，等.电子封装无铅软钎焊技术研究进展［J］.材料导报. 2019，33（23）：3862-3875.

JIANG N， ZHANG L， XIONG M Y， et al. Research progress of lead-free soldering technology for electronic packaging［J］. Materials Reports. 2019，33（23）：3862-3875.

林和德，林明山，温明生.接触式点胶阀的创新设计［J］.机床与液压. 2019，47（15）：131-133+144.

LIN H D， LIN M S， WWN M S. Innovative design of contact dispensing valve［J］. Machine Tool & Hydraulics. 2019，47（15）：131-133+144.

李冉，韩金龙.一种送丝装置，激光器，送丝方法及熔丝方法：CN114178648A［P］. 2022-03-15.

王大明，王普钢，廖科述.天线产品无铅焊料选型分析研究［J］.现代信息科技，2019，3（13）： 41-43+46.

WANG D M， WANG P G， LIAO K S. Analysis and research on lead-free solder selection of antenna products［J］. Modern Information Technology， 2019， 3（13）： 41-43+46.

李丙旺，吴慧，向圆，等. BGA植球工艺技术［J］.电子与封装， 2013，13（06）： 1-6+37.

LI B W，WU H，XIANG Y，et al. BGA planting technology［J］. Electronics & Packaging， 2013， 13（06）： 1-6+37.

张辉.SMT表面贴装技术工艺应用探讨［J］.轻工科技， 2015，31（03）：99-100.

ZHANG H. Discussion on SMT Surface Mount Technology Application［J］. Light Industry Science and Technology， 2015，31（03）：99-100.

编辑部网址：http：//www.71dhj.comhttp://www.71dhj.com

Alert me when the article has been cited

提交

暂无数据