Effect of On-load Aging Time on the Structure of SnInBi Soldering Interface

LIU Xiyang; WANG Yang; YANG Miaosen; MA Yiming; LUO Jiutian; WU Pengbo

doi:10.7512/j.issn.1001-2303.2023.08.04

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Effect of On-load Aging Time on the Structure of SnInBi Soldering Interface
Vol. 53, Issue 8, Pages: 22-27(2023)
DOI： 10.7512/j.issn.1001-2303.2023.08.04

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刘西洋，汪洋，杨淼森，等.带载老化时间对SnInBi钎焊界面结构的影响［J］.电焊机，2023，53（8）：22-27.

LIU Xiyang, WANG Yang, YANG Miaosen, et al.Effect of On-load Aging Time on the Structure of SnInBi Soldering Interface[J].Electric Welding Machine, 2023, 53(8): 22-27.
刘西洋，汪洋，杨淼森，等.带载老化时间对SnInBi钎焊界面结构的影响［J］.电焊机，2023，53（8）：22-27. DOI： 10.7512/j.issn.1001-2303.2023.08.04.

LIU Xiyang, WANG Yang, YANG Miaosen, et al.Effect of On-load Aging Time on the Structure of SnInBi Soldering Interface[J].Electric Welding Machine, 2023, 53(8): 22-27. DOI： 10.7512/j.issn.1001-2303.2023.08.04.

摘要

以SnInBi低温钎料为研究对象，借助SEM、EDS表征手段，研究了不同带载老化时间对钎焊界面的组织形貌、金属间化合物（IMC）厚度和成分的影响。结果表明：带载老化时间变化对SnInBi低温钎料界面结构有显著影响。随着带载老化时间的增加，IMC层连续性变好，近基体侧凸起消失，近低温钎料侧小凸起合并并向低温钎料一侧延伸生长；界面IMC层厚度和生长速度随着带载老化时间的增加而增大（带载720 h时厚度增加了5倍，平均增长速度达到0.021 4 μm/h）；Bi元素分布随着老化时间的变化无明显偏析；Cu元素向IMC层扩散明显，伴随有向低温钎料一侧凸起生长的现象；In元素发生了由不均匀分布变为均匀分布再变为不均匀分布的变化；Sn元素分布与In元素分布趋势相反；带载时间达到480 h时钎焊界面出现富In层和富Sn层，富Sn层厚度达到41.43 μm。

Abstract

The effects of aging time on microstructure, thickness and composition of intermetallic compounds (IMC) were studied by means of SEM and EDS.The results show that the interfacial structure of SnInBi brazing metal is significantly affected by the aging time under load.With the increase of load aging time, the continuity of IMC layer becomes better, the bulges near the matrix disappear, and the small bulges on the near low temperature filler metal side merge and extend to the low temperature filler metal side. The thickness and growth rate of interfacial IMC layer increased with the increase of loading aging time (the thickness increased by 5 times at 720 h, and the average growth rate reached 0.021 4 μm/h). There is no obvious segregation of Bi element distribution with aging time. The diffusion of Cu into the IMC layer is obvious, accompanied by the growth of bulges on one side of the directional low temperature filler metal. In elements have uneven distribution and uniform distribution changes. The distribution trend of Sn element is opposite to that of In element. When the load time reaches 480 h, the rich in layer and rich Sn layer appear on the brazed interface, and the rich Sn layer thickness reaches 41.43 μm.

关键词

IMC带载老化SnInBi钎料钎焊界面

Keywords

IMCon-load agingSnInBi soldersoldering interface

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