ZHANG Mingyue, ZHANG Min'an, XU Yonggang, et al.Effect of Ni Plating on Intermetallic Compounds in MnCuAl Alloy/430SS Brazed Joint[J].Electric Welding Machine, 2023, 53(4): 103-111.
Intermetallic compounds (IMCs) distributed at the interface reduce the bonding strength of MnCuAl alloy/430 stainless steel (430SS) brazed joints, and then reduce the performance of welding structure. Ni layer is electroplated on 430SS surface to inhibit the formation of IMC in the joint, then the effect and mechanism of Ni layer with different thickness on joint structure and IMC are investigated. The results show that there is no obvious defect at the interface between the Ni plating and the substrate, and the Ni plating can be well combined with the 430SS substrate. For the brazed joint without Ni plating, γ-(Fe, Mn) solid solution layer is distributed at the interface of the 430SS side, and there are continuous distribution IMCs between the reaction layer and the center of the brazing seam on both sides, accompanied by the brazing flux residue. When 8 μm Ni layer is electroplated, the Ni layer completely dissolves after welding, γ-(Fe, Mn) solid solution layer is still distributed at the interface of the 430SS side, but IMCs disappeare and only a few brazing flux remaines. When the plating is 20 μm, there is a residual Ni plating layer on the 430SS side after welding, no γ-(Fe, Mn) solid solution layer is found, IMCs disappeare, and no residue of brazing flux is observed. It is concluded that Ni plating can inhibit the formation of IMCs by alloying and blocking when its thickness is 8 μm and 20 μm respectively.
关键词
MnCuAl阻尼合金430不锈钢异种金属钎焊电镀Ni层金属间化合物界面
Keywords
MnCuAl damping alloy430SSdissimilar metal brazingelectroplated Ni layerintermetallic compoundinterface
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