SU Zilong, XU Yonggeng, GAO Lei, et al. Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding. [J]. 50(5):10-15(2020)
DOI:
SU Zilong, XU Yonggeng, GAO Lei, et al. Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding. [J]. 50(5):10-15(2020) DOI: 10.7512/j.issn.1001-2303.2020.05.02.
Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding
The electromagnetic pulse welding technology was ad opted to complete the connection of 99.0Sn-0.3Ag-0.7Cu(SAC0307) and T2 Cu thin plates with different charging voltage of 13 kV,14 kV,15 kV under the condition that the air gap was 1.5 mm. The microstructure,tensile strength and micro-hardness of the welded joints were then studied.The results show that the critical charging voltage of succe-ssful SAC0307/Cu electromagnetic pulse welding is between13 kV and14 kV;when the charging voltage is kept at 15 kV,the welded joint obtained has the best performance,its tensile strength is 22.23 MPa,and the average micro-hardness at the interface is 41.04 HV.In addition,scanning electron micros-copy and X-ray spectroscopy analysis reveal that no intermetallic compounds are found in the welded joints.
关键词
电磁脉冲焊接异种金属连接界面显微组织力学性能
Keywords
electromagnetic pulse weldingdissimilar metal connectioninterfacemicrostructuremechanical property