Research progress of improving mechanical properties of Sn-Bi series lead-free solder

YAN Lijing; HUANG Yongqiang; JI Haitao; ZHANG Yanhua

doi:10.7512/j.issn.1001-2303.2020.02.08

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Research progress of improving mechanical properties of Sn-Bi series lead-free solder
Vol. 50, Issue 2, Pages: 41-44(2020)
DOI： 10.7512/j.issn.1001-2303.2020.02.08

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YAN Lijing, HUANG Yongqiang, JI Haitao, et al. Research progress of improving mechanical properties of Sn-Bi series lead-free solder. [J]. 50(2):41-44(2020)
DOI：

YAN Lijing, HUANG Yongqiang, JI Haitao, et al. Research progress of improving mechanical properties of Sn-Bi series lead-free solder. [J]. 50(2):41-44(2020) DOI： 10.7512/j.issn.1001-2303.2020.02.08.

摘要

电子产品微型化、集成化、绿色化促进了无铅钎料的发展。Sn-Bi系钎料以其优良的综合性能成为近年来比较有发展潜力的低温无铅钎料之一,但是Sn-Bi系钎料中Bi的脆性在很大程度上限制了其应用。综述了Ag、Cu、Zn、Sb、Ni、稀土元素以及冷却方式和温度对Sn-Bi系钎料力学性能的影响及机理,并展望了改善Sn-Bi系钎料力学性能的研究方向。

Abstract

关键词

Sn-Bi系钎料合金元素力学性能

Keywords

Sn-Bi系钎料合金元素力学性能

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Research progress of improving mechanical properties of Sn-Bi series lead-free solder

DOI： 10.7512/j.issn.1001-2303.2020.02.08

摘要

Abstract

关键词

Keywords

references