Research status of Sn-Ag lead-free solders

QUAN Shengkai; ZHANG Liang; XIONG Mingyue; ZHAO Meng

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Research status of Sn-Ag lead-free solders
Vol. 49, Issue 9, Pages: 6-18(2019)
DOI：

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QUAN Shengkai, ZHANG Liang, XIONG Mingyue, et al. Research status of Sn-Ag lead-free solders. [J]. 49(9):6-18(2019)
DOI：

QUAN Shengkai, ZHANG Liang, XIONG Mingyue, et al. Research status of Sn-Ag lead-free solders. [J]. 49(9):6-18(2019) DOI：

摘要

简述近年来国内外Sn-Ag系无铅钎料的研究现状,着重探讨Bi、In、Zn、Al、Cu、Ni、Sb等合金元素、稀土元素、纳米颗粒对Sn-Ag系无铅钎料的润湿性能、熔化特性、力学性能、显微组织以及界面组织的影响,同时对Sn-Ag系无铅钎料研究过程中存在的问题进行了探讨并提出相应的解决方法,为Sn-Ag系无铅钎料的研究提供参考。

Abstract

The investigation status of Sn-Ag lead-free solders Is reviewed comprehensively. The effects of Bi,In,Zn,Al,Cu,Ni,Sb et al rare earths and nanoparticles on the wetting properties,melting temperature,mechanical properties,microstructure and interfacial reactions are discussed. In addition,the problems in the study of Sn-Ag solders are discussed and solutions are proposed. It provides a reference for the research of Sn-Ag lead-free solder.