组合导管感应钎焊代替火焰钎焊工艺可行性研究
Feasibility Study of Induction Brazing Instead of Flame Brazing for Combined Conduits
- 2025年55卷第8期 页码:116-121
收稿:2024-10-14,
修回:2024-11-21,
纸质出版:2025-08-20
DOI: 10.7512/j.issn.1001-2303.2025.08.13
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收稿:2024-10-14,
修回:2024-11-21,
纸质出版:2025-08-20
移动端阅览
针对航空氧气系统T2紫铜导管与HPb59-1黄铜平管嘴火焰钎焊工艺存在的明火安全风险、环境污染及效率低下问题,本研究采用高频感应钎焊技术进行替代可行性分析。通过对比Ag45CuZn钎料在火焰钎焊(8组试样)与感应钎焊(10组试样)下的质量差异,系统开展无损检测、力学性能及显微组织表征。结果表明:感应钎焊接头外观质量显著优于火焰钎焊,钎角成形饱满(R3.0~4.5 mm),焊后无需打磨,所有试样均通过31 MPa耐压试验;X射线检测发现1组火焰钎焊接头存在2个
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0.5 mm气孔(间距0.6 mm),感应钎焊试样无内部缺陷,仅低热输入组(25 A/40 s)出现0.94 mm未焊透;两类工艺接头抗剪切强度均高于母材(断裂发生于铜管本体),但火焰钎焊显微组织存在密集型微气孔(最大尺寸
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0.25 mm);EDS分析表明钎料/HPb59-1界面冶金反应比钎料/T2更为剧烈,30 A电流下黄铜晶粒长大明显,Zn元素已扩散至紫铜母材。研究证实感应钎焊可有效消除气孔缺陷并提升工艺安全性,但需严格控制热输入参数(推荐电流≤28 A)以避免黄铜熔蚀风险。
To address the safety hazards (open flame)
environmental pollution
and low efficiency associated with flame brazing of T2 copper conduits and HPb59-1 brass flat nozzles in aircraft oxygen systems
this study investigates the feasibility of replacing conventional flame brazing with
high-frequency induction brazing. A comparative analysis of joint quality was conducted using Ag45CuZn filler metal on flame-brazed (8 samples) and induction-brazed (10 samples) specimens through non-destructive testing (X-ray)
mechanical property assessment (shear strength)
and microstructural characterization (metallography
EDS). Key findings reveal: Induction-brazed joints exhibit superior surface quality with fully formed fillets (R3.0-4.5 mm)
eliminating post-weld polishing. All specimens passed 31 MPa pressure tests. X-ray inspection detected two
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0.5 mm pores (spaced 0.6 mm apart) in one flame-brazed joint
while induction-brazed samples showed no internal defects except for 0.94 mm incomplete penetration in the low-heat-input group (25 A/40 s). Both processes produced joints with shear strength exceeding the base metal (fracture occurred in the copper tube)
but flame-brazed microstructures contained clustered micropores (maximum
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0.25 mm). EDS analysis confirmed more intens
e metallurgical reactions at the filler/HPb59-1 interface than at the filler/T2 interface. Significant grain growth was observed in brass under 30A current
with Zn diffusion into the copper substrate. The study demonstrates that induction brazing effectively eliminates porosity and enhances process safety. Strict control of heat input parameters (recommended current ≤28 A) is critical to mitigate brass dissolution risks.
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