SAC0307/Cu电磁脉冲焊接接头的组织和性能研究

苏子龙; 徐永庚; 高雷; 王刚; 冉洋; 尹立孟

doi:10.7512/j.issn.1001-2303.2020.05.02

焊接工艺 | 浏览量 : 0 下载量: 489 CSCD: 0

PDF
导出
分享
收藏
专辑

SAC0307/Cu电磁脉冲焊接接头的组织和性能研究
Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding
2020年50卷第5期页码：10-15
纸质出版：2020
DOI： 10.7512/j.issn.1001-2303.2020.05.02
稿件说明：

移动端阅览

苏子龙, 徐永庚, 高雷, 等. SAC0307/Cu电磁脉冲焊接接头的组织和性能研究[J]. 电焊机, 2020,50(5):10-15. DOI： 10.7512/j.issn.1001-2303.2020.05.02.

SU Zilong, XU Yonggeng, GAO Lei, et al. Microstructure and property of SAC0307/Cu welded joint by via electromagnetic pulse welding[J]. Eletric Welding Machine2020, 50(5): 10-15. DOI： 10.7512/j.issn.1001-2303.2020.05.02.

摘要

在保证空气间隙1.5 mm不变的情况下

采用电磁脉冲焊接技术分别在13 kV、14 kV和15 kV的充电电压下完成了99.0Sn-0.3Ag-0.7Cu(SAC0307)和T2 Cu薄板的连接

并对其焊接接头的显微组织、拉伸强度和显微硬度进行了研究。结果表明:SAC0307/Cu电磁脉冲焊接的临界充电电压介于13～14 kV之间;当充电电压为15 kV时

获得的焊接接头性能最佳

其拉伸强度为22.23 MPa

界面平均显微硬度为41.04 HV;此外

扫描电镜观察和X射线能谱分析发现

接头中基本没有金属间化合物形成。

Abstract

The electromagnetic pulse welding technology was ad opted to complete the connection of 99.0Sn-0.3Ag-0.7Cu（SAC0307） and T2 Cu thin plates with different charging voltage of 13 kV

14 kV

15 kV under the condition that the air gap was 1.5 mm. The microstructure

tensile strength and micro-hardness of the welded joints were then studied.The results show that the critical charging voltage of succe-ssful SAC0307/Cu electromagnetic pulse welding is between13 kV and14 kV;when the charging voltage is kept at 15 kV

the welded joint obtained has the best performance

its tensile strength is 22.23 MPa

and the average micro-hardness at the interface is 41.04 HV.In addition

scanning electron micros-copy and X-ray spectroscopy analysis reveal that no intermetallic compounds are found in the welded joints.