Design and Thermal Performance Study of a Macro-Micro Coupled Heat Sink based on Gyroid Structures

YANG Yan; LI Huaqiao; ZHANG Zihao; TANG Jinyao; ZHAO Yang; WANG Dongwei

doi:10.7512/j.issn.1001-2303.2026.03.15

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Design and Thermal Performance Study of a Macro-Micro Coupled Heat Sink based on Gyroid Structures
Vol. 56, Issue 3, Pages: 111-118(2026)
Received：14 December 2025，

Revised：2026-01-18，

Published：20 March 2026
DOI： 10.7512/j.issn.1001-2303.2026.03.15
稿件说明：

移动端阅览

杨妍，李华桥，张子浩，等.基于Gyroid结构的宏观-微观耦合式散热器设计与性能研究［J］.电焊机，2026，56（3）：111-118. DOI： 10.7512/j.issn.1001-2303.2026.03.15.

YANG Yan, LI Huaqiao, ZHANG Zihao, et al.Design and Thermal Performance Study of a Macro-Micro Coupled Heat Sink based on Gyroid Structures[J].Electric Welding Machine, 2026, 56(3): 111-118. DOI： 10.7512/j.issn.1001-2303.2026.03.15.

摘要

针对国产高功率芯片在有限空间内面临的热流密度剧增、局部过热严重的散热瓶颈问题，提出了一种基于增材制造的宏观-微观耦合式散热解决方案。研究以三重周期极小曲面（TPMS）中的Gyroid构型为核心，将其填充于传统翅片通道以构建复合散热结构。通过拓扑优化与有限元分析，设计并制备了三种不同结构参数的AlSi10Mg合金散热器样件（孔隙率/比表面积分别为64%/3.8、71%/3.1、80%/2.2）。环境试验结果表明：在自然对流条件下，最优Gyroid结构散热器（64%孔隙率，3.8比表面积）相比传统翅片散热器最高温度降低16.2%；在强制对流条件下，最高温度降低9.7%。同时，该结构显著改善了温度均匀性。本研究阐明了关键结构参数对散热性能的协同作用机理，为基于增材制造的国产芯片高性能散热器设计提供了理论与实验依据。

Abstract

This work addresses the critical thermal management challenge of dramatically increasing heat flux and severe localized overheating in domestically produced high-power chips within confined spaces. A macro-micro coupled cooling solution based on additive manufacturing is proposed. The work employs the Gyroid configuration

a type of Triply Periodic Minimal Surface (TPMS) structure

as the core element

integrating it into the channels of traditional fins to construct a composite heat dissipation architecture. Through topology optimization and finite element analysis

three AlSi10Mg alloy heat sink prototypes with different structural parameters (with porosity/specific surface area of 64%/3.8

71%/3.1

and 80%/2.2

respectively) were designed and fabricated. Environmental test results demonstrate that under natural convection conditions

the optimal Gyroid structure heat sink (64% porosity

3.8 specific surface area) achieved a 16.2% reduction in maximum temperature compared to a conventional finned heat sink. Under forced convection conditions

a reduction of 9.7% was observed. Furthermore

this structure significantly improved temperature uniformity. This work elucidates the synergistic mechanism of key structural parameters on thermal performance

providing both theoretical and experimental foundations for the design of high-performance heat sinks for domestic chips based on additive manufacturing.

关键词

Keywords

references

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