Interfacial Regulation and Atomic Diffusion in TA1 Brazed with Al/Ag/Al solder

GUO Chenjun; PEI YinYin; SUN Yixiang

doi:10.7512/j.issn.1001-2303.2025.10.14

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Interfacial Regulation and Atomic Diffusion in TA1 Brazed with Al/Ag/Al solder
Vol. 55, Issue 10, Pages: 122-130(2025)
Received：28 August 2025，

Published：20 October 2025
DOI： 10.7512/j.issn.1001-2303.2025.10.14
稿件说明：

移动端阅览

郭琛骏，孙逸翔，裴夤崟.Al/Ag/Al钎料钎焊TA1的原子扩散机制研究与界面调控［J］.电焊机，2025，55（10）：122-130. DOI： 10.7512/j.issn.1001-2303.2025.10.14.

GUO Chenjun, PEI YinYin, SUN Yixiang.Interfacial Regulation and Atomic Diffusion in TA1 Brazed with Al/Ag/Al solder[J].Electric Welding Machine, 2025, 55(10): 122-130. DOI： 10.7512/j.issn.1001-2303.2025.10.14.

摘要

针对钛合金传统钎焊易氧化、高温损伤母材的问题，提出采用原位合成Ag-Al基钎料（Al/Ag/Al三明治结构）对TA1纯钛进行低温钎焊。通过分子动力学模拟与真空钎焊试验相结合，系统揭示了Ag-Al-Ti体系的原子扩散机制与界面反应规律。分子动力学模拟表明：Al原子因较小原子半径（1.43 Å）和低扩散激活能（Q=36.227 kJ/mol），通过间隙扩散主导α-Ti渗入过程，优先形成TiAl

金属间化合物；而Ag原子扩散激活能较高（Q=87.42 kJ/mol），扩散系数显著低于Al原子。模拟轨迹显示Al原子扩散轨迹在Ti晶格中呈规则折线，同时Al-Ag互扩散在高温下形成无序非晶态，径向分布函数（RDF）证实Al-Ag成键作用随温度增强。试验验证在1 073 K/30 min工艺下可获得无缺陷接头，其典型组织为TA1/TiAl

+Ag（ss，Al）/TA1，其中TiAl

相通过弥散强化提升力学性能，Ag（ss，Al）固溶体填充间隙。力学测试表明Ag-Al基钎料钎焊接头抗剪切强度优于纯Ag或Al中间层扩散连接接头，断裂模式为韧性与沿晶混合断裂。证实该钎料设计可在降低钎焊温度（低于β转变点）的同时提升接头可靠性，为钛合金钎料设计和钎焊工艺制订提供原子尺度依据。

Abstract

This study addresses the issues of easy oxidation and base metal damage in conventional brazing of titanium alloys by proposing an in-situ synthesized Ag-Al-based filler (Al/Ag/Al sandwich structure) for low-temperature brazing of TA1 pure titanium. Combining molecular dynamics simulations and vacuum brazing experiments

the atomic diffusion mechanisms and interfacial reaction behaviors in the Ag-Al-Ti system were systematically investigated. Molecular dynamics simulations using the EAM potential revealed that Al atoms

due to their smaller atomic radius (1.43 Å) and lower diffusion activation energy (Q=36.227 kJ/mol)

dominate the penetration into α-Ti via interstitial diffusion

preferentially forming TiAl₃ intermetallic compounds. In contrast

Ag atoms exhibit a higher diffusion activation energy (Q=87.42 kJ/mol) and a significantly lower diffusion coefficient than Al atoms. Simulation trajectories showed that the diffusion paths of Al atoms follow a regular zigzag pattern within the Ti lattice

while mutual Al-Ag diffusion at elevated temperatures leads to the formation of a disordered amorphous phase. Radial distribution function (RDF) analysis confirmed enhanced Al-Ag bonding interactions with increasing temperature. Experimental validation under the optimized brazing condition (1 073 K/30 min) produced defect-free joints with a typical microstructure of TA1/TiAl₃ + Ag(ss

Al)/TA1. The TiAl₃ phase contributes to strength improvement through dispersion strengthening

and the Ag(ss

Al) solid solution fills interfacial gaps. Mechanical tests demonstrated that the brazed joints using the Ag-Al filler exhibit higher shear strength than those using pure Ag or Al interlayers via diffusion bonding. Fracture analysis indicated a mixed failure mode of ductile and intergranular fracture. This filler design effectively reduces the brazing temperature (below the β-transus point) while improving joint reliability

providing atomic-scale insights for low-temperature and high-efficiency joining of titanium alloys.

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