In-Situ Generated Mo-Ni-Si Phase Strengthens the Mechanical Properties of Mo-Re Alloy/AlN Ceramic Brazed Joints

FU Mengchun; LIN Panpan; LIN Tiesong; HE Peng

doi:10.7512/j.issn.1001-2303.2025.10.03

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In-Situ Generated Mo-Ni-Si Phase Strengthens the Mechanical Properties of Mo-Re Alloy/AlN Ceramic Brazed Joints
Vol. 55, Issue 10, Pages: 22-28(2025)
Received：28 August 2025，

Published：20 October 2025
DOI： 10.7512/j.issn.1001-2303.2025.10.03
稿件说明：

移动端阅览

傅孟春，林盼盼，林铁松，等.原位生成Mo-Ni-Si提升Mo-Re合金/AlN陶瓷钎焊接头力学性能［J］.电焊机，2025，55（10）：22-28. DOI： 10.7512/j.issn.1001-2303.2025.10.03.

FU Mengchun, LIN Panpan, LIN Tiesong, et al.In-Situ Generated Mo-Ni-Si Phase Strengthens the Mechanical Properties of Mo-Re Alloy/AlN Ceramic Brazed Joints[J].Electric Welding Machine, 2025, 55(10): 22-28. DOI： 10.7512/j.issn.1001-2303.2025.10.03.

摘要

随着现代电力电子技术的飞速发展，关键领域的高密度散热需求对封装材料提出严苛要求，钼铼合金与氮化铝陶瓷的高可靠连接组件可有效应对高温与极端复杂工况的需求。本研究采用镍基多主元钎料成功实现了钼铼合金与氮化铝的钎焊连接，探究了保温时间对接头微观结构演变及力学性能的影响。得益于接头内原位形成的Mo-Ni-Si三元相，有效缓解接头残余应力，在1 100 ℃/45 min工艺参数下，接头室温剪切强度为111 MPa，1000 ℃高温剪切强度为62 MPa。本研究为钼铼合金与氮化铝陶瓷的高可靠高质量连接提供了新思路，优异高温力学特性接头有望拓展极端环境电子封装领域的应用。

Abstract

With the rapid advancement of modern electronics technology

high-density heat dissipation demands in critical applications impose stringent requirements on packaging materials. High-reliability joint components made from Mo-Re alloy and AlN ceramic can effectively meet the needs of high-temperature and extremely complex working conditions. In this study

the joining of Mo-Re alloy and AlN ceramic was successfully achieved using a Ni-based multi-principal element brazing filler. The effects of holding time on microstructural evolution and mechanical properties of the joint were investigated. Benefiting from the in-situ formed Mo-Ni-Si ternary phase within the joint

residual stresses were effectively relieved. Under the process parameters of 1100 ℃/45 min

the room-temperature shear strength of the joint reached 111 MPa

and the high-temperature shear strength at 1000 ℃ was 62 MPa

respectively. This study provides a novel approach for achieving high-reliability

high-quality connections between Mo-Re and AlN

and the joints with excellent high-temperature mechanical properties are expected to expand the applications in extreme-environment electronic packaging..

关键词

Keywords

references

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