Cross-sectional Properties and Bonding Characteristics of Copper Coatings Deposited by Electroburst Jetting on Aluminum Surfaces

LI Bosen; ZHU Liang; REN Jiwei; AN Junjin; ZHOU Hui

doi:10.7512/j.issn.1001-2303.2025.08.03

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Cross-sectional Properties and Bonding Characteristics of Copper Coatings Deposited by Electroburst Jetting on Aluminum Surfaces
Vol. 55, Issue 8, Pages: 38-46(2025)
Received：16 May 2024，

Revised：2025-01-19，

Published：20 August 2025
DOI： 10.7512/j.issn.1001-2303.2025.08.03
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栗勃森，朱亮，任继炜，等.铝基铜涂层的管约束电爆喷射沉积方法及其特性［J］.电焊机，2025，55（8）：38-46. DOI： 10.7512/j.issn.1001-2303.2025.08.03.

LI Bosen, ZHU Liang, REN Jiwei, et al.Cross-sectional Properties and Bonding Characteristics of Copper Coatings Deposited by Electroburst Jetting on Aluminum Surfaces[J].Electric Welding Machine, 2025, 55(8): 38-46. DOI： 10.7512/j.issn.1001-2303.2025.08.03.

摘要

铜、铝物理性能差异较大，且铝基体表面易形成致密氧化膜，导致传统喷涂技术制备的铝基铜涂层结合强度低、易开裂。采用自主研发的管约束连续丝电爆喷射沉积装置制备铝基铜涂层，该方法可有效去除铝基体表面氧化层，改善涂层结合强度。研究结果显示，当初始充电电压11 kV、电容储量6.66 µF、电极间距60 mm、铜丝丝径0.3 mm、喷射距离30 mm时，能有效清除铝基体表面氧化膜；在其他参数不变的情况下，将初始充电电压调整为9.5 kV，制备的铜涂层致密、均匀、平整度好，与基体形成典型的冶金结合界面，涂层粗糙度Ra=0.9 μm、Sa=1.9 μm，达到微米级。弯曲试验表明铜涂层与基体结合效果良好，对铝基铜涂层截面的EBSD分析证实，电爆喷射沉积法制备的铜涂层对基体表面具有细晶强化作用，且铜涂层的耐蚀性与导电性均优于铝基体。该方法为铝基铜涂层材料的制备提供了新思路。

Abstract

The physical properties of copper and aluminum differ significantly. Due to the dense oxide film that easily forms on the surface of the aluminum substrate

the bonding strength of aluminum-based copper coatings prepared by traditional spraying techniques is low and they are prone to cracking. By using a self-developed continuous wire electric explosion deposition device with tube constraints

an aluminum-based copper coating is prepared. This method can effectively remove the oxide layer on the surface of the aluminum substrate and improve the bonding strength of the coating. Research results show that when the initial charging voltage is 11 kV

the capacitance is 6.66 µF

the electrode spacing is 60 mm

the copper wire diameter is 0.3 mm

and the spraying distance is 30 mm

the oxide film on the surface of the aluminum substrate can be effectively removed. When other parameters remain unchanged and the initial charging voltage is adjusted to 9.5 kV

the prepared copper coating is dense

uniform

and smooth

forming a typical metallurgical bonding interface with the substrate. The coating roughness Ra=0.9 μm and Sa=1.9 μm achieve micron levels. Bending tests indicate that the bonding effect between the copper coating and the substrate is good. EBSD analysis of the cross-section of the aluminum-based copper coating confirms that the copper coating prepared by the electric explosion deposition method has a fine-grain strengthening effect on the substrate surface

and the corrosion resistance and conductivity of the copper coating are superior to those of the aluminum substrate. This method provides a new approach for the preparation of aluminum-based copper coating materials.

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