Residual Stress Numerical Simulation of Selective Laser Melting for GH4169 Alloy

Guodong ZHAO; Hao WANG; Jianping ZHAO

doi:10.7512/j.issn.1001-2303.2022.07.02

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Residual Stress Numerical Simulation of Selective Laser Melting for GH4169 Alloy
Vol. 52, Issue 7, Pages: 7-17(2022)
Received：13 February 2022，

Revised：2022-03-07，

Published：25 July 2022
DOI： 10.7512/j.issn.1001-2303.2022.07.02
稿件说明：

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赵国栋，王昊，赵建平.GH4169激光选区熔化成形残余应力数值模拟研究［J］.电焊机，2022，52（7）：7-17. DOI： 10.7512/j.issn.1001-2303.2022.07.02.

ZHAO Guodong, WANG Hao, ZHAO Jianping.Residual Stress Numerical Simulation of Selective Laser Melting for GH4169 Alloy[J].Electric Welding Machine, 2022, 52(7): 7-17. DOI： 10.7512/j.issn.1001-2303.2022.07.02.

摘要

利用有限元分析软件ABAQUS模拟了镍基高温合金GH4169激光选区熔化成形过程，利用子程序DFLUX实现了三维高斯体热源的编译，子程序UMATHT定义了材料的状态转变，通过子程序USDFLD定义了不同状态下的材料参数，并考虑了相变潜热和粉体实体状态导热系数的不同对温度场的影响。研究结果表明：熔池达到最高温度后，降温速率刚开始很快，当温度降到熔点左右时明显变慢；随着扫描层数的增加，热量会逐渐累积，但是实体区域会逐渐变大，导热系数也会变大，导致散热加快；平行于扫描方向的热应力远大于垂直于扫描方向的应力；各工艺参数下残余应力最大值基本保持在725 MPa，沿

方向最小残余应力为327.1 MPa，而沿

向最小残余应力仅为11.6 MPa。

Abstract

The selective laser melting process of nickel base super alloy GH4169 is simulated by finite element analysis software ABAQUS. The compilation of three-dimensional Gaussian volume heat source is realized by subroutine DFLUX. The subroutine UMATHT defines the state transition of materials

and the material parameters in different states are defined by subroutine USDFLD

the effects of phase transformation latent heat and thermal conductivity of powder solid state on the temperature field are considered. The results show that after the molten pool reaches the maximum temperature

the cooling rate is fast at first

and slows down obviously when the temperature drops to about the melting point; with the increase of the number of scanning layers

the heat will gradually accumulate

but the solid area will gradually become larger and the thermal conductivity will become larger

resulting in faster heat dissipation; the thermal stress parallel to the scanning direction is much greater than the stress perpendicular to the scanning direction; the maximum residual stress under each process parameter is basically kept at 725 MPa

the minimum residual stress along the

direction is 327.1 MPa

and the minimum residual stress along the

direction is only 11.6 MPa.

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