Study on microstructure of Al-Cu dissimilar metal joint by resistance soldering
Vol. 48, Issue 3, Pages: 92-96(2018)
Published:2018
DOI:
稿件说明:
移动端阅览
DOI:
LIU Yong, HAN Xiaohui, YE Jiehe, et al. Study on microstructure of Al-Cu dissimilar metal joint by resistance soldering[J]. Eletric Welding Machine2018, 48(3): 92-96.DOI:
Study on microstructure of Al-Cu dissimilar metal joint by resistance soldering
It is very important for the safe operation of the train to make sound connections between the dissimilar metal joints in the high-speed train manufacturing process. In order to overcome the shortcomings of the current welding of copper and aluminum
this paper introduces a method to connect aluminum plate and copper plate by resistance soldering. Under the parameters of orthogonal test design
it is successful to braze a sample of large area after a series of experiments. At the same time
when observing the microstructure of Al-Cu resistance soldered joint using SEM
it is found that in the appropriate soldering specifications the solder material distributes and joints to the parent metal
atoms of major elements in the solder and the parent metal Al and Cu can mutual diffusion
infiltration and achieve a combination between atoms
the solder microstructure reveals no obvious defects.