Research status of Sn-Ag lead-free solders

QUAN Shengkai; ZHANG Liang; XIONG Mingyue; ZHAO Meng

Views : 0 下载量: 1470 CSCD: 2

PDF
Export
Share
Collection
Album

Research status of Sn-Ag lead-free solders
Vol. 49, Issue 9, Pages: 6-18(2019)
Published：2019
DOI：
稿件说明：

移动端阅览

DOI：

QUAN Shengkai, ZHANG Liang, XIONG Mingyue, et al. Research status of Sn-Ag lead-free solders[J]. Eletric Welding Machine2019, 49(9): 6-18. DOI：

摘要

简述近年来国内外Sn-Ag系无铅钎料的研究现状

着重探讨Bi、In、Zn、Al、Cu、Ni、Sb等合金元素、稀土元素、纳米颗粒对Sn-Ag系无铅钎料的润湿性能、熔化特性、力学性能、显微组织以及界面组织的影响

同时对Sn-Ag系无铅钎料研究过程中存在的问题进行了探讨并提出相应的解决方法

为Sn-Ag系无铅钎料的研究提供参考。

Abstract

The investigation status of Sn-Ag lead-free solders Is reviewed comprehensively. The effects of Bi

Sb et al rare earths and nanoparticles on the wetting properties

melting temperature

mechanical properties

microstructure and interfacial reactions are discussed. In addition

the problems in the study of Sn-Ag solders are discussed and solutions are proposed. It provides a reference for the research of Sn-Ag lead-free solder.

关键词

Keywords

references

Alert me when the article has been cited

提交

Microstructure and Mechanical Properties of CMT-Welded X80 Pipeline Steel Joints

Microstructure and Mechanical Properties of Ti31 Titanium Alloy Fabricated by Selective Laser Melting

Study of Microstructure and Mechanical Properties of 7075 Aluminum Alloy FSW Joints

The Effect of Different Welding Parameters on the Microstructure and Properties of FSW Joints of 7075-2A12 Dissimilar Aluminum Alloy

Research on the Welding Process of 2507 Super Duplex Stainless Steel in the Flat Screen Filter Equipment of Nuclear Power Plants